IR Temperature Monitoring Solution for Wallboard Production
The TIP900 system is a comprehensive thermal imaging and noncontact profiling system designed to supervise the temperature of wallboards coming out of the oven. It uses an infrared thermal imager to continuously scan the entire board surface temperatures and allows the detection in real time of moisture and density variations inside each board.
The powerful TIP900 software provides sophisticated data integration, visualization and event analysis, and offers users a complete solution of real-time monitoring, detection and traceability. It also analyzes and provides optimal oven dryer profile balance.
The detailed wallboard quality maps, the historical temperature trend charts and the images can be seen locally at the operator workstation or remotely. All data is stored in the LogViewer database for complete process visibility and long term traceability.
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|Temperature Range||350 ºC max. (662 ºF max.)|
|Ambient Temperature||0 to 50 °C (32 to 122 °F)|
|Accuracy||±2% of measured value or ±2 ºC (4 ºF), whichever is greater|
|Repeatability||±1% of measured value or ±1 ºC (2 ºF), whichever is greater|
|Shock||IEC 60068-2-27, 3 axes, operating: 5 g at 11 ms, 15 g at 6 ms|
|Vibration||IEC 60068-2-6, 3 axes, 10 to 150 Hz, operating 2 g above 20 Hz|
|Industrial Touch PC Pannel (Windows 7)|
|Screen Attributes||1920 x 1080 pixels|
|Hard Drive||500 GB|
The TIP900 system performs real-time board temperature monitoring, defect detection & rejection, and dryer balance imaging. The thermal imager scans the entire board surface temperatures with more than 40,000 data points each second. This high level of resolution allows the system to automatically detect the most minor board quality issues.Failure Detection
Intelligent TIP900 software package is designed to monitor and adjust for maximum board quality and detect defects or process changes.