IR Temperature Monitoring Solution for Wallboard Production

TIP900 System

The TIP900 system is a comprehensive thermal imaging and noncontact profiling system designed to supervise the temperature of wallboards coming out of the oven. It uses an infrared thermal imager to continuously scan the entire board surface temperatures and allows the detection in real time of moisture and density variations inside each board.

The powerful TIP900 software provides sophisticated data integration, visualization and event analysis, and offers users a complete solution of real-time monitoring, detection and traceability. It also analyzes and provides optimal oven dryer profile balance.

The detailed wallboard quality maps, the historical temperature trend charts and the images can be seen locally at the operator workstation or remotely. All data is stored in the LogViewer database for complete process visibility and long term traceability.

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  • Complete turnkey industrially designed hardware & software system
  • User-friendly software with clear graphical overview on a single screen
  • Detailed continuous board quality monitoring
  • Real-time detection of bubbles, blisters and clumps
  • Failure identification function tracked in database
  • Automatic live rejection of defective boards
  • Database LogViewer for historical analysis and can be used as a quality tool
  • High resolution thermal imager for accurate infrared images
  • Complete hardware system configured for harsh environments
  • Network connectivity for remote communication
  • Onsite TIP900 system configuration and training of your operators


Thermal Imager
Temperature Range 350 ºC max. (662 ºF max.)
Ambient Temperature 0 to 50 °C (32 to 122 °F)
Accuracy ±2% of measured value or ±2 ºC (4 ºF), whichever is greater
Repeatability ±1% of measured value or ±1 ºC (2 ºF), whichever is greater
Shock IEC 60068-2-27, 3 axes, operating: 5 g at 11 ms, 15 g at 6 ms
Vibration IEC 60068-2-6, 3 axes, 10 to 150 Hz, operating 2 g above 20 Hz
Industrial Touch PC Pannel (Windows 7)
Screen Attributes 1920 x 1080 pixels
Screensize 21.5”
Processor Intel i7
Hard Drive 500 GB


The TIP900 system performs real-time board temperature monitoring, defect detection & rejection, and dryer balance imaging. The thermal imager scans the entire board surface temperatures with more than 40,000 data points each second. This high level of resolution allows the system to automatically detect the most minor board quality issues.

Failure Detection
  • Over/under-dried boards
  • Paper blisters
  • Edge peel/end burns
  • Paper blows
  • Mixer voids & clumps
  • Belt splices
  • Overlapped boards
  • Cracks and bubbles


Intelligent TIP900 software package is designed to monitor and adjust for maximum board quality and detect defects or process changes.

  • Detailed continuous board quality monitoring (100% of all board images are archived)
  • Easy recipe setup – automated scaling
  • Automated board defect detection and rejection
  • Ethernet connectivity: process data, defect reports, dryer balance profile, etc., can be shared with HMI/SCADA
  • Dynamic deck-to-deck dryer profile balance monitoring
  • Failure identification function tracked in database
  • Database LogViewer for historical analysis (for remote access viewing of any TIP900 on a company network)
  • Configurable reject/alarm parameters