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Wafer Polishing

Get the temperature data you need without touching the wafer.

Due to the nature of the polishing process, a non-contact measurement solution is required, making both the Thermalert 4.0 family of pyrometers and Compact MI3-100 series sensors ideal solutions for this application.

  • At a Glance
  • Featured Solutions

After a single crystal ingot rod is produced, it is cut into 1mm-thick wafers and polished. In traditional polishing applications, wafers are placed into a slurry of liquid with rotating pads. This process typically doesn’t exceed temperatures above 35°C (95°F) because if the wafers are overheated, they will be destroyed.

Because of this, temperature control is critical, and since the wafer is covered in a film of liquid, an 8-14 micron sensor is required in order to get an accurate temperature measurement – as the sensor can measure the temperature of the liquid coating the wafer.

Infrared Temperature Solutions
  • Dedicated spectral models P3 (3.43 µm) and P7 (7.9 µm) to provide accurate temperature measurements even for very thin plastics even for very low temperature (P3 down to 25° (77 (°F) and P7 10°C (50 °F))
  • Spectal ranges P3 and P7 in one product series cover most common plastic materials
Infrared Temperature Solutions
  • Standard USB 2.0 digital interface for remote setup and configuration with optional network communications module (RS485)
  • Field Calibration Software for on-site calibration of sensors, reducing service time and expense
  • Standard optically isolated 48VAC/300mA relay outputs eliminate need for separate limit switches or alarms

Get more information about Fluke Process Instruments solutions for this application


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