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Temperature Monitoring in Construction Materials

TIP900 Wallboard Profiling Thermal Imaging System

Complete turnkey temperature monitoring system for wallboard production

TIP900 Wärmebildsystem für die Gipskartonherstellung

Detailed continuous board quality monitoring

  • Real-time detection of bubbles, blisters and clumps
  • Automatic live rejection of defective boards
  • User-friendly software with clear graphical overview on a single screen
  • Complete hardware system configured for harsh environments
  • Network connectivity for remote communication
  • Onsite TIP900 system configuration and training of your operators
  • At a Glance
  • Technical Specs
  • Applications
  • Resources

The TIP900 system is a comprehensive thermal imaging and noncontact profiling system designed to supervise the temperature of wallboards coming out of the oven. It uses an infrared thermal imager to continuously scan the entire board surface temperatures and allows the detection in real time of moisture and density variations inside each board.

The powerful TIP900 software provides sophisticated data integration, visualization and event analysis, and offers users a complete solution of real-time monitoring, detection and traceability. It also analyzes and provides optimal oven dryer profile balance.

The detailed wallboard quality maps, the historical temperature trend charts and the images can be seen locally at the operator workstation or remotely. All data is stored in the LogViewer database for complete process visibility and long term traceability.

TIP900 System Software Features

  • Detailed continuous board quality monitoring (100% of all board images are archived)
  • Easy recipe setup – automated scaling
  • Automated board defect detection and rejection
  • Ethernet connectivity: process data, defect reports, dryer balance profile, etc., can be shared with HMI/SCADA
  • Dynamic deck-to-deck dryer profile balance monitoring
  • Failure identification function tracked in database
  • Database LogViewer for historical analysis (for remote access viewing of any TIP900 on a company network)
  • Configurable reject/alarm parameters
Feature Description
Temperature Range 20 to 350°C (68 to 662°F)
Spectral Response 3 to 5 μm
System Accuracy ± 2 % of measured value or ±2°C (4°F) whichever is greater
Repeatability ± 1 % of measured value or ±1°C (2°F) whichever is greater
Shock IEC 60068-2-27, 3 axes, operating: 5 g at 11 ms, 15 g at 6 ms
Vibration IEC 60068-2-6, 3 axes, 10 to 150 Hz, operating 2 g above 20 Hz
Ambient Temperature 0 to 50°C (32 to 122°F)
Scan Angle (FOV)
Scanning Resolution 256 pixel @ 150 Hz, 512 pixel @ 76 Hz, 1024 pixel @ 36 Hz


Standards and Compliance

EC Directive Directive 2004/108/EC (EMC) The device complies with the requirements of the European Directives
KCC Electromagnetic Compatibility applies to use in Korea. This product meets requirements for industrial (Class A) electromagnetic wave equipment.
PV cells lamination-process

The TIP900 system performs real-time board temperature monitoring, defect detection and rejection, and dryer balance imaging. The thermal imager scans the entire board surface temperatures with more than 40,000 data points each second. This high level of resolution allows the system to automatically detect the most minor board quality issues.

Failure Detection

  • Over/under-dried boards
  • Paper blisters
  • Edge peel/end burns
  • Paper blows
  • Mixer voids & clumps
  • Belt splices
  • Overlapped boards
  • Cracks and bubbles

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