The Thermoforming TF Thermal Imaging System features a variety of linescanning systems that provide continuous, accurate and real-time thermal images and temperature measurements for thermoforming processes.
The GS Glass Processes System provides continuous, accurate and real-time thermal images and temperature measurements for moving processes in glass bending, forming, annealing and tempering, as well as low emissivity (low-E) glass production.
The TIP900 system is a comprehensive thermal imaging and noncontact profiling system designed to supervise the temperature of wallboards coming out of the oven. It uses an infrared thermal imager to continuously scan the entire board surface temperatures and allows the detection in real time of moisture and density variations inside each board. Intelligent TIP900 software package is designed to monitor and adjust for maximum board quality and detect defects or process changes.
Specifically designed for kiln monitoring, the CS210 Thermal Imaging System is a fully integrated solution that monitors rotary kilns to detect hot spots and avoid costly damage and unscheduled downtime.