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Refow Tracker System with new Datapaq DP5 datalogger

Datapaq® Reflow Tracker Thermal Profiling System

The Profiling Solution for the Electronics Assembly Industry

Refow Tracker System
Reflow Tracker System Software
Reflow Tracker System Dataloggers
Reflow Tracker System Thermal Barriers
Reflow Wave Palette
Refow Tracker System
Reflow Tracker System Software
Reflow Tracker System Dataloggers
Reflow Tracker System Thermal Barriers
Reflow Wave Palette

Measure and track process stability

  • Collect repeatable data and create SPC analysis to predict maintenance needs in advance
  • Ensure and prove that solder profile specifications are met
  • Fine-tune the soldering process to maximize throughput
  • Automate the selection of oven settings for faster changeover times

Monitor the temperatures for every soldering application – including wave, reflow, vapor phase, selective and rework stations.

  • At a Glance
  • Technical Specs
  • Applications
  • Accessories
  • Resources

The Datapaq® Reflow Tracker® temperature profiling system is comprised of specifically designed thermocouples, data loggers, protective thermal barriers and Insight software, to help you optimize process and product quality.

Datapaq DP5 Datalogger

The Datapaq DP5 is rugged and reliable temperature data logger utilizing the latest electronic technology to ensure the optimal size/performance balance. It is housed in a machined-from-solid aluminum case to ensure longest service life and lowest cost of ownership.  

The Datapaq DP5 features include:

  • Temperature range: -100°C to 1370°C (-385°F to 2498°F) (type K thermocouples)
  • User replaceable Nimh battery pack
  • Exceptionally slim footprint - less than 60mm (2.5”) wide and low height - less than 12mm (0.5”)
  • Sampling rate as low as 0.05 seconds
  • 50000 readings per channel in 6 and 12 channel formats
  • High accuracy +/- 0.5°C (0.9°F)
  • Easy-to-use Start/Stop buttons
  • Communication via ultra-fast USB
  • Battery recharging from any USB power outlet

Thermal Barriers

Employing the same insulation technology as that used in an aircraft's 'black box', Datapaq thermal barriers are housed in a rugged stainless steel casing, designed to last for many years. Rugged, yet lightweight, these barriers withstand process temperatures run after run. Our most popular barrier weighs only 0.7 kg (1.6 lb) and can survive temperatures of 300 ºC (572 ºF) for over eight minutes.

Insight Software for Reflow Tracker: Basic, Standard and Professional versions

Insight software is an easy-to-use analysis package designed by Datapaq to meet the needs of the electronics assembly industry. With a typical reflow soldering profile lasting only six minutes, users don't want to spend additional time analyzing the profile. Insight Software ensures that the user is presented with a detailed analysis immediately and it comes in the following versions:

Insight Basic Software for Reflow Tracker has the power needed to convert raw data into information quickly and easily. It has wizards to guide infrequent users helping to ensure that each step is carried out efficiently. The result is a cost-effective and easy-to-use software solution that can used to analyze the soldering profile in depth and provide full reports on process performance.

Insight Standard Software for Reflow Tracker, the solution of choice for many users, builds on the basic software by adding both profile prediction and recipe calculation functionality. This transforms the basic profile analysis software into a full process optimization solution. The Easy Oven Setup recipe calculator can calculate the optimum oven settings in seconds, thus saving hours at every process changeover.

Insight Professional Software for Reflow Tracker is the choice of the frequent user and in high volume production environments. The Professional software includes the ability to eliminate the variability associated with the use of golden boards by use of the Datapaq Surveyor concept. The enhanced SPC Surveyor analysis software is designed to spot trends in your oven’s performance and avoid processes that are out of specification. Add the option of the adjustable width frame with Surveyor sensors, and you have the complete setup, optimization and long term process monitoring solution.

Thermocouples

Thermocouple probes are an essential part of a Datapaq Reflow Tracker system. They are placed in critical points on the product to give a clear profile of the temperature throughout the process. No one makes a more robust probe. All Datapaq probes are constructed with alloys that conform to the highest standards (ANSI MC 96.1 Special Limits of Error) and provide the most accurate data possible.

Datapaq DP5 Data Loggers

Datapaq DP5 Data Loggers
Model Number
DP5660
DP5661
DP5662
DP5612
DP5622
Dimensions
11.7 x 106 x 150 mm
0.46 x 4.1 x 5.9”
11.7 x 60 x 301 mm
0.46 x 2.3 x 11.8”
20 x 57 x 165 mm
0.7 x 2.2 x 6.4”
20 x 106 x 165 mm
0.7 x 4.1 x 6.4”
20 x 60 x 237 mm
0.7 x 2.3 x 9.3”
Channels 
 6 or 12
Temperature range
-100 to 1370°C (-148 to 2498°F)
Dependent on thermocouple type (Type K shown)
Connectivity
USB or Bluetooth*
Memory capacity
50,000 data points
Start/stop triggers
Manual, Rising/falling temperature
Sampling interval
0.5 sec – 10 mins with no telemetry
Accuracy 
± 0.5 °C (0.9 °F) – Type K
Resolution
± 0.1°C (0.18 °F)
Thermocouple type
Type K (J,N,T,R,S,B are available)
Multiple run capability
Up to 10 profile runs before returning to PC

*Contact Fluke Process Instruments for availability of RF telemetry and Bluetooth in your country.

 

THERMAL BARRIERS SUITABLE FOR 6 CHANNEL DATA LOGGER – DP5660

Model Number
TB2064
TB2015
TB2065
Type
Low height thermal barrier*
Standard thermal barrier
Long duration thermal barrier
Application
Ovens with very tight clearances
Standard processes and ovens
Longer and higher temperature processes
Dimensions
20×133×210 mm
(0.8×5.2×8.3”)
25×133×210 mm
(1.0×5.2×8.3”)
29×133×210 mm
(1.1×5.2×8.3”)
Weight
0.6 kg (1.3 lb)
0.68 kg (1.5 lb)
0.68 kg (1.5 lb)
Thermal duration
9 min @ 200ºC (392ºF)
8 min @ 250ºC (482ºF)
6 min @ 280ºC (536ºF)
13 min @ 200ºC (392ºF)
10 min @ 250ºC (482ºF)
9 min @ 280ºC (536ºF)
13 min @ 200ºC (392ºF)
11 min @ 250ºC (482ºF)
10 min @ 280ºC (536ºF)

* If rapid re-use is required or a longer than standard process is to be profiled, then consider TB2015 or TB2065.

 

THERMAL BARRIERS SUITABLE FOR 6 CHANNEL SUPER SLIM DATA LOGGER – DP5661

Model Number
TB2066
TB2067
TB2068
Type
Low height, super-slim thermal barrier
Standard, super-slim thermal barrier
Long duration, super-slim thermal thermal barrier
Application
Low height, very narrow ovens
Standard height, narrow ovens, frequent profiling
Limited size ovens, longer and higher temperature processes
Dimensions
20×87×328 mm
(0.8×3.4×12.9”)
25×87×328 mm
(1.0×3.4×12.9”)
29×87×328 mm
(1.1×3.4×12.9”)
Weight
0.65 kg (1.4 lb)
0.75 kg (1.7 lb)
0.8 kg (1.8 lb)
Thermal duration
8 min @ 200ºC (392ºF)
6 min @ 250ºC (482ºF)
6 min @ 280ºC (536ºF)
11 min @ 200ºC (392ºF)
10 min @ 250ºC (482ºF)
8 min @ 280ºC (536ºF)
13 min @ 200ºC (392ºF)
11 min @ 250ºC (482ºF)
10 min @ 280ºC (536ºF)

 

THERMAL BARRIERS SUITABLE FOR 6 CHANNEL NARROW DATA LOGGER – DP5662

Model Number
TB2020
TB2021
Type
Low height, narrow thermal barrier
Narrow thermal barrier with insulation for rapid re-use
Application
Ovens with limited width and height
Dimensions
28×84×223 mm
(1.1×3.3×8.8”)
35×84×223 mm
(1.3×3.3×8.8”)
Weight
0.5 kg (1.1 lb)
0.65 kg (1.4 lb)
Thermal duration
10 min @ 200ºC (392ºF)
8 min @ 250ºC (482ºF)
7 min @ 280ºC (536ºF)
13 min @ 200ºC (392ºF)
11 min @ 250ºC (482ºF)
10 min @ 280ºC (536ºF)

 

THERMAL BARRIERS SUITABLE FOR 12 CHANNEL DATA LOGGER – DP5612

Model Number
TB2100
TB2101
Type
Low height,12 channel thermal barrier
Standard 12 channel thermal barrier
Application
Low height convection ovens or IR reflow soldering
Standard convection ovens or IR reflow soldering
Dimensions
28×134×225 mm
(1.1×5.3×8.9”)
35×134×225 mm
(1.3×5.3×8.9”)
Weight
0.7 kg (1.5 lb)
0.8 kg (1.8 lb)
Thermal duration
10 min @ 200ºC (392ºF)
8 min @ 250ºC (482ºF)
7 min @ 280ºC (536ºF)
13 min @ 200ºC (392ºF)
11 min @ 250ºC (482ºF)
10 min @ 280ºC (536ºF)

 

THERMAL BARRIERS SUITABLE FOR 12 CHANNEL DATA LOGGER – DP5622

Model Number
TB2081
TB2082
Type
Low-height 12-channel thermal barrier
Standard 12-channel thermal barrier
Application
Restricted-size convection ovens or IR reflow soldering
Dimensions
28×88×288 mm
(1.1×3.4×11.3”)
35×88×288 mm
(1.3×3.4×11.3”)
Weight
0.6 kg (1.3 lb)
0.7 kg (1.4 lb)
Thermal duration
10 min @ 200ºC (392ºF)
8 min @ 250ºC (482ºF)
7 min @ 280ºC (536ºF)
13 min @ 200ºC (392ºF)
11 min @ 250ºC (482ºF)
10 min @ 280ºC (536ºF)

 

Thernal profiling in circuit assembly manufacturing processThe Reflow Tracker system can be used to monitor the full range of circuit assembly manufacturing process, reflow and circuit board testing to ensure high quality end-products. Check our list of applications below or contact us with your specific application requirements.

  • Wave soldering – with the CS5006 and CS5012 wave pallets, offering up to 9 contact sensors and 3 preheat sensors, the Reflow Tracker system offers a low cost process monitoring solution for all wave soldering applications.
  • Vacuum soldering – increasingly used to reduce voids in the joints. The small size and low thermal mass of the thermal barriers means the Reflow Tracker system can be used in most vacuum soldering ovens.
  • Vapour phase soldering - a range of sealed and lighter weight thermal barriers enable users to profile this process with minimal process disturbance.
  • Rework stations – the ability to monitor at high speed in real time, either via the USB cable or Bluetooth connection, ensures the Datapaq DP5 is the ideal solution for monitoring rework stations of any type.
Special and Custom Solutions

The experienced engineering team at Fluke Process Instruments has produced numerous thermal barriers for applications, ranging from temperatures of -40°C to 1350°C (-40°F to 2462°F). They can design a complete solution for your specific requirements. Contact us to request information about a custom Datapaq thermal profiling solution.

The Reflow Tracker Radio Telemetry System

Radio telemetry accessory

The Reflow Tracker Radio Telemetry System allows you to see in real time what happens to your product during the heat treatment process. You can compare actual product temperatures to specification during the process and optimize cycle times. 

Surveyor System consisting of an adjustable frame, fixed temperature sensors and enhanced SPC Surveyor analysis software, available only in Insight Professional Software, this tool is designed to spot trends in your oven’s performance and avoid processes that are out of specification.

Wave Solder Analysis Kit is a tool for regular repeatable process monitoring. It enables you to profile PCB/component temperatures, or use the pallet with its integral PCB coupon to monitor process stability and wave conditions. All critical process parameters are displayed in one, easy-to-read table – the wave and preheat data, as well as the temperature profile graph.

 

Thermocouples for use in electronics assembly industry

PA0210 – Fast responsive exposed junction

This is the standard thermocouple used throughout the reflow industry and is constructed from type K thermocouple wire. Each conductor is PTFE insulated and then twisted together to prevent tangling in use. The wire diameter is 0.2 mm (.007 in), providing a good compromise between size and strength. The thermocouple tip is pre-tinned to ease soldering to the PCB.

  • Length 800 mm (31.4 in)
  • Conductor diameter 0.2 mm (.007 in)
  • Temperature - 265 ºC (509 ºF) maximum
PA1683 – Fine wire

This thermocouple has been developed specifically for use with BGA and ultra fine pitch surface mount components. The type K thermocouple conductors are 0.1 mm (.003 in) in diameter, each insulated with PTFE. The two conductors are then over-wrapped with a single outer PTFE sheath to prevent tangling in use. The recommended attachment method is activated flux and high temperature solder.

  • Length 500 mm (19.6 in)
  • Conductor diameter 0.1 mm (.003 in)
  • Temperature - 265 ºC (509 ºF) maximum
PA1571 – Ultra fine diameter, mineral insulated

The PA1571 is intended for use in high temperature applications. It is a Type K mineral insulated thermocouple with an Inconel outer sheath. The overall diameter is 0.5 mm (.01 in). Attachment method will depend on the application, but can include ceramic cement or mechanical fixtures.

  • Length 600 mm (23.6 in)
  • Conductor diameter - NA (outer sheath is 0.5 mm / .01 in)
  • Temperature - 1,000 ºC (1832 ºF) maximum
PA0215 – Fiber insulated probe

Exposed junction type K thermocouple constructed from 0.2 mm (.007 in) wire with glass fiber insulation. This probe is designed for continuous use up to 355 ºC (671 ºF) and is therefore ideally suited to high temperature soldering applications. For best results, we recommend that the probe is attached using an activated flux and high temperature solder.

  • Length 800 mm (31.4 in)
  • Conductor diameter - 0.2 mm (.007 in)
  • Temperature - 355 ºC (671 ºF) continuous, 400 ºC (752 ºF) intermittent

 

Probe Accessories

PA0885 Surveyor sensor (horizontal plugs) long for use with DP5660 and Surveyor PA0883. Surveyor sensor using type K thermocouples to ANSI MC96.1 special limits of error. Dual horizontal thermocouple plugs fitted to mounting plate.

PA0886 Surveyor sensor (dual vertical plug) for use with DP5662 and DP5612 and Surveyor PA0884 Surveyor sensor using type K thermocouples to ANSI MC96.1 special limits of error. Fitted with dual vertical plug.

PA1321 Wave solder contact sensor 420 mm long to be used on CS5006, CS5012 wave soldering pallets.
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