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Thermal profiling in reflow soldering
Thermal profiling in reflow soldering
Electronics Industry
Control circuit assembly manufacturing process to ensure high quality end-products
Compare performance of different soldering machines and ensure their optimization
Observe and verify process uniformity for consistent and reliable results
Define and test the correct soldering process settings

Quickly detect faulty solder joints to ensure quality with fixed thermal imaging technology.

The last step in manufacturing a circuit board is testing final product to ensure everything is operating at 100%.

Optimize your soldering process to minimize downtime and ensure minimal reject rates.

After the wafer (circuit board) has been etched, polished and heat treated, it must be cut out, soldered and undergo the reflow process. In this application, it is crucial that the product reaches and maintains a specific temperature through the entire process. If the product goes above or below the specified temperature threshold there will be problems with the circuit board, and it will be scrapped.

Our team of experts will work with you to fully understand your process and needs before suggesting a specific solution.

Once the chemical vapor deposition (CVD) process is complete, the wafers must be heat treated. However, there are multiple different ways that the wafer can be heat treated depending on your process and facility – including quartz tube lamps, induction heating, and resistance coating.

Control your process temperature while it evolves with non-contact infrared sensors.

Molecular beam epitaxy is a known process for producing thin-film depositions on single crystals. This process takes place in an ultra-high vacuum, which reduces carbon contamination in the reaction chamber and can result in a grown crystal with an extremely high purity.

Ensure product quality with targeted edge-to-edge infrared temperature measurements.

Like most applications in the semiconductor industry, your ideal solution depends on your process and how it is set up. For most atomic layer deposition (ALD) processes, we recommend the MP Linescanner series, which can be installed on top of the reaction chamber to look through any slits or openings for non-uniformities or hot spots on the product. The MP Linescanner series also includes the ability to alert you when temperatures are beyond set parameters and can be programmed to calculate average, maximum or minimum temperatures.

Ensure product quality with targeted and continuous infrared temperature measurements.

Like other applications in the semiconductor industry, your ideal solution depends on your facility; however, there are multiple options that are ideal for integration with your process. In CVD processing, you can rely on products like the Thermalert 4.0 and other spot sensors to get the exact temperature every time.

Get the temperature data you need without touching the wafer.

Due to the nature of the polishing process, a non-contact measurement solution is required, making both the Thermalert 4.0 family of pyrometers and Compact MI3-100 series sensors ideal solutions for this application.

Keep temperatures under your control with products designed to integrate with your process.

Once created, the polysilicon must be processed through a crystal pulling machine to become a single crystal. There are several applications that rely on temperature control in this process. One application requires users to control the crucible temperature on the crystal pulling machine, which relies on temperature control in a variety of spots.

By monitoring your process continuously, you can maintain consistent rod temperatures with ease.

Fluke Process Instruments offers several measurement tools designed to continuously monitor your process so you can easily maintain consistent rod temperatures. Some facilities, for example, prefer to use a single-color unit, such as the Endurance, Thermalert 4.0 or Mi3-100 because a single wavelength is less affected by the silicon coating. However, two-color pyrometers, such as the Endurance Series, can be used because you don’t have to fill the entire sighting field to measure rod temperature and, in some instances, can be used with explosion-proof housing when Hydrogen gas is present.

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